US
Patent # 2,308,204
Means for Affecting Plant Life
Processes
This invention relates to a method of and apparatus for activation or
suppression of biological processes, especialy those processes
substantially affected by high frequency electric fields.
This method provides for practical treatment of substantial quantitites
of stock by industrial concerns so efficiently that the benefits of
such treatment are available to effect substantial industrial economy.
For example, it is advantageous to treat
seed bean stock having an untreated
germination factor of from 2 to 4 % and render that stock 40%
germinative. In like manner the method is effective in the
activation or deactivation of fruits to accelerate or retard their life
processes, and to delay the advance of their maturation, as well as to
otherwise control plant life through promotion of plant health as by
devitalization of parasitic, fungus, and insect pests.
Industrial application of high frequency treatment requires the
expensiture of large amounts of energy and equipment capacity not
heretofore available.
In accordance with the principles of my invention the materials to be
treated are subjected to variable high voltage and high frequency
electric fields, being passed therethrough for a period of time
dependent upon empirical determination of effectiveness. The requisite
energy capacity for industrial application is made available between
two electrodes, or electrically conductive plates, the dimensions of
which are so calculated with respect to the frequency of the electric
field required that these two electrodes have resonant characteristics,
that is to say, a maximum proportion of available energy is available
for activation of the material between the plates.
The frequency of the energy pulses supplied to the plates is preferably
maintained by an electric oscillating circuit, an oscillator being so
related to the electrodes that the voltage of the energy passing to the
electrodes is varied in accordance with the oscillator energy wave, in
such fashion that it is impractical to permit its flow in ordinary
oscillating circuits such as heretofore been employed.
In the drawing:
Figure 1 is a circuit diagram,
partially fragmentarily elevational, of the apparatus;
Figure 2 is a fragmentary plan;
Figure 3 is a voltage stress
diagram.
The materials
m to be treated
are carried by an endless belt 2, one
each of which passes through an electric field produced by an
oscillating voltage difference existing between a pair of conducting
plates 4 and 6 to the adjacent ends 8 and 10 of each of which are
attached a figh frequency electric energy supply, here comprising the
plates P of power vacuum tubes 12 and 14. The filaments of these tubes
are attached to the negative terminals of a power supply 16, the
positive bus 13 of which supply is electrically conected to the remote
ends 20 and 22 of plates 4 and 6 as by a slide contractor 24.
The distance between the points A and B in meters is calculated as
300,000,000 divided by 4 times the frequency in cycles per second, or
one-quarter wave length of the frequency to be used. Accordingly, if
the frequency required for a particular processing is 15 MHz, the
distance AB is 5 meters. As the frequency increases, AB becomes shorter
and the slider 24 may be adjusted for this requirement, or plates of
different lengths may be provided, integrated therewith at 20 and 22,
for each frequency required.
The energy passing to the plates 4 and 6 is controlled by the
oscillator circuit grids G which form the termini of the variable
oscillator circuit O, and which receives its energy from the direct
current source 16-18.
A variable capacitor VC adjusts the oscillator frequency and voltage
thereof is applied on the grids G, which, in turn, influence the flow
of current from the filaments F to the plates 4 and 6 so that the
natural or resonant frequency of the oscillator circuit is exactly
equal to the resonant frequency of the lines 4 and 6.
If a larger capacity is desired the widths of the plates 4 and 6 may be
increased and the speed of travel of the belt 2 may be enlarged in
accordance with the demand for additional capacity.
As illustrated, the field is created by a resonant line, short
circuited at its remote end. Other resonant lines and oscillating
circuits may be employed, with a generally like effect, but that
described is preferable.
As illustrated, employing the paltes 4 and 6 alone, and moving the
stock
m transversely to the
length AB, it is evident that the voltage
stress varies from A to B, being at all times a maximum at A and zero
at B, and distributed according to the nature of the imposed sine wave
from A to B. Accordingly, diverse portions of the material along the
belt from A to B are subjected to different voltage gradients and this
fact must be taken into account. If voltages between the limits are
satisfactory, the position of the material on the belt may be specified
for this exigency.
If uniform treatment is desired, the material may be moved in the
direction AB or BA, so that all of it passes through the same section
across the line AB.
Treatment between certain voltage limits is often satisfactory and in
such instances the arrangement employing an additional set of plates
4'-6' which are shorted at B' and have input terminals at A', in
opposed
relation to AB, is useful. The material at the midpoint is subjected to
the least stress, which would be the maximum available for any constant
condition, while the maximum voltage would be available between the
ends of the plate pairs respectively.
Instead of using the belt 2, the plates 4 and 6 may be juxtaposed in
vertical planes, as imaginable in connection with Figure 2, and so
proportioned with respect to velocity of free fall, or restrained fall,
of material in process therebetween, that the required length of
treatment is obtained.
It has been pointed out that large quantities of energy may be usefully
expended incident to the resonant condition between plates 4 and 6
without, however, dissipating excessive quantities of waste energy due
to resistance and electromagnetic losses. This is made possible by the
resonant characteristics of the plates, their large size in respect of
the material to be treated, and their size in comparison with the
wavelength...