Anthony SUTERA, et
al.
Spray-On Antenna
MATERIAL USED FOR PROPAGATION, EMISSION
& ABSORPTION OF EM RADIATION --
WO2012078362 //
US2012146855
Nano-Copper
Nano-Antennas
http://news.cnet.com/8301-17938_105-57376903-1/spray-on-antenna-wireless-in-a-can/
February 13, 2012
Spray-on antenna: Wireless in a can
by Amanda Kooser
Chamtech's spray-on antenna uses a nano material to provide a
low-power boost to antenna range. The wireless-in-a-can product
may some day bring an end to unsightly cell towers. The antenna
can, seen next to a closeup of the nano material.
(Credit: Video screenshot by Amanda Kooser/CNET)
It sounds like a particularly suspicious late-night infomercial:
Spray your way to a better wireless signal! Improve your range!
Save battery! Transmit over great distances under water!
But Chamtech's spray-on antenna is a real product with some
impressive claims. It can be sprayed on almost any surface, even
trees and orange barrels. It doesn't suck up power. It works in a
mysterious nanotech way.
Here's how I imagine the antenna process goes:
Step 1: Spray antenna material on surface.
Step 2: Connect phone to material.
Step 3: ????
Step 4: Make a phone call to the moon.
Chamtech co-founder Anthony Sutera imagines a world where wireless
antenna towers are replaced with nano-paint on walls, and issues
like iPhone Antennagate are a thing of the past.
"We have come up with a material that when you spray it on, it
lays out just in the right pattern and all of these little
capacitors charge and discharge extremely quickly in real time and
they don't create any heat," Sutera says in a video presentation
about the product.
One of Chamtech's tests turned an RFID chip with a 5-foot range
into an RFID chip with a 700-foot range. The company lists a spray
antenna kit on its site, but pricing for the public is not
revealed. The U.S. government is reportedly already playing with
the new material.
If all these claims bear out, then I can see everybody wanting to
get their hands on a fresh can full of antenna. My only question
is where in the grocery store it will be stocked: with the spray
cheese or with the gold food paint?
http://www.neowin.net/news/the-amazing-spray-on-antenna
12 February 2012
The amazing spray-on antenna
by
Tyler Holman
Wouldn't it be great if you could just pop out a can of
spray-on antenna and boost your signal whenever it was running
low? Chamtech Enterprises is hoping to make that dream a reality,
and if you happen to work for the government, it already is,
according to Chamtech's Solve for X presentation.
Chamtech took to Google's Solve for X to show off the new
technology. The company plans to turn its focus towards mobile
phones and medical devices, offering a quick solution to boosting
signals from existing antennas, or creating new ones. Chamtech's
'antenna in a can' is far more efficient than traditional antenna
models, offering energy savings equal to 12 times the amount of
energy generated by solar and wind in the US annually - and it
even works great underwater.
A traditional antenna would require thousands of watts to send out
a signal with a one mile range underwater. Chamtech's can do that
with only three watts, and have a stronger signal to boot. So how
does all of this work?
The truth is, we don't really know. According to Chamtech's
co-founder Anthony Sutera, he and his team came up with it in his
living room two years ago. It works by manipulating magnetic and
radio signals through mysterious organic materials, and you can
spray it on any virtually any surface and hook into it with a
flexible circuit cable.
According to Sutera, the US government has had a lot of success
with the technology, getting better performance out of it than
their existing portable antennas, which he described as some of
the best around. With the efficiency and mobility offered, it
could even be used to rapidly deploy new infrastructure in
disaster areas.
Sutera and chief technology officer Rhett Spencer have coated
their car antennas with the stuff, boasting that they can now
listen to radio stations in Salt Lake City fifty miles away, with
10,000-foot mountain range in between. Within a few months, they
hope to be thinking about financing the company, and are looking
at venture capital options to help them bring their technology to
you.
For his part, Spencer can't wait. “Can you imagine the
infrastructure side of things? Telecomm under the oceans, Internet
infrastructure, ships and satellite communications in the sea–
they can do it out under the water.” Check out video of Chamtech's
Solve for X presentation below.
http://www.youtube.com/watch?feature=player_embedded&v=4efE_gO9lFo
http://chamtechops.com/news/
Chamtech / Sutera Patents
MATERIAL USED FOR AT LEAST ONE OF PROPAGATION, EMISSION AND
ABSORPTION OF ELECTROMAGNETIC RADIATION
WO2012078362
Also published as: US2012146855
An antenna system and method for fabricating an antenna are
provided. The antenna system includes a substrate (310) and an
antenna. The antenna includes a conductive particle based material
(320) applied onto the substrate (310). The conductive particle
based material (320) includes conductive particles and a binder.
When the conductive particle based material (320) is applied to
the substrate (310), the conductive particles are dispersed in the
binder so that at least a majority of the conductive particles are
adjacent to, but do not touch, one another.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit under 35 U.S.C. $119(e)
of a U.S. provisional patent application filed on Nov. 22, 2010 in
the U.S. Patent and Trademark Office and assigned Ser. No.
61/416,093, a U.S. provisional patent application filed on Apr. 8,
2011 in the U.S. Patent and Trademark Office and assigned Ser. No.
61/473,726, a U.S. provisional patent application filed on Apr.
20, 2011 in the U.S. Patent and Trademark Office and assigned Ser.
No. 61/477,587, and a U.S. provisional patent application filed on
Aug. 2, 2011 in the U.S. Patent and Trademark Office and assigned
Ser. No. 61/514,435, the entire disclosure of each of which is
hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to techniques for a material
used for at least one of propagation, emission and absorption of
electromagnetic radiation. More particularly, the present
invention relates to techniques for a conductive particle based
material used for at least one of propagation, emission and
absorption of electromagnetic radiation.
[0004] 2. Description of the Related Art
[0005] A conventional antenna is a device with an arrangement of
one or more conductive elements that are used to generate a
radiating electromagnetic field in response to an applied
alternating voltage and the associated alternating electric
current, or can be placed in an electromagnetic field so that the
field will induce an alternating current in the antenna and a
voltage between its terminals. The conductive elements employed in
the conventional antenna are typically fabricated from solid
metallic conductors. However, the use of solid metallic conductors
is limiting.
[0006] Therefore, a need exists for an improved material used for
at least one of propagation, emission and absorption of
electromagnetic radiation, and implementations of the improved
material.
SUMMARY OF THE INVENTION
[0007] An aspect of the present invention is to address at least
the above-mentioned problems and/or disadvantages and to provide
at least the advantages described below. Accordingly, an aspect of
the present invention is to provide techniques for a conductive
particle based material used for at least one of propagation,
emission and absorption of electromagnetic radiation.
[0008] In accordance with an aspect of the present invention, an
antenna system is provided. The antenna system includes a
substrate and an antenna. The antenna includes a conductive
particle based material applied onto the substrate. The conductive
particle based material includes conductive particles and a
binder. When the conductive particle based material is applied to
the substrate, the conductive particles are dispersed in the
binder so that at least a majority of the conductive particles are
adjacent to, but do not touch, one another.
[0009] In accordance with another aspect of the present invention,
an antenna enhancer system is provided. The antenna enhancer
system includes an antenna and an antenna enhancer. The antenna
enhancer includes a conductive particle based material. The
antenna enhancer is disposed adjacent to and offset from the
antenna. The conductive particle based material comprises
conductive particles and a binder. When the conductive particle
based material is disposed adjacent to and offset from the
antenna, the conductive particles are dispersed in the binder so
that at least a majority of the conductive particles are adjacent
to, but do not touch, one another.
[0010] In accordance with yet another aspect of the present
invention, a method for fabricating a conformable antenna is
provided. The method includes selecting a substrate on which to
fabricate an antenna, selecting a template corresponding to an
antenna design, the template comprising one or more cut out
portions, applying a conductive particle based material, through
the one or more cutout portions of the template, and onto the
substrate to form the antenna, and fixing a coupler of a feed line
to the antenna. The conductive particle based material comprises
conductive particles and a binder. When the conductive particle
based material is applied to the substrate, the conductive
particles are dispersed in the binder so that at least a majority
of the conductive particles are adjacent to, but do not touch, one
another.
[0011] Other aspects, advantages, and salient features of the
invention will become apparent to those skilled in the art from
the following detailed description, which, taken in conjunction
with the annexed drawings, discloses exemplary embodiments of the
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The above and other aspects, features, and advantages of
certain exemplary embodiments of the present invention will be
more apparent from the following description taken in conjunction
with the accompanying drawings, in which:
[0013] FIG. 1 is a captured image of a conductive particle
based material according to an exemplary embodiment of the
present invention;
[0014] FIG. 2 illustrates a conductive particle based
antenna according to an exemplary embodiment of the present
invention;
[0015] FIG. 3 illustrates a structure of a conductive
particle based antenna according to an exemplary embodiment of
the present invention;
[0016] FIG. 4 illustrates an implementation of a
conductive particle based antenna enhancer according to an
exemplary embodiment of the present invention;
[0017] FIG. 5 illustrates a structure of a coated
conductive particle based antenna enhancer according to an
exemplary embodiment of the present invention;
[0018] FIG. 6 illustrates an antenna partially coated
with a conductive particle based antenna enhancer according to
an exemplary embodiment of the present invention;
[0019] FIG. 7 illustrates a template used to fabricate
a conductive particle based conformable antenna according to an
exemplary embodiment of the present invention;
[0020] FIG. 9 illustrates a method for fabricating a
conductive particle based conformable antenna using a
computerized device according to an exemplary embodiment of the
present invention; and
[0021] FIG. 10 illustrates a structure of computerized
device used for fabricating a conductive particle based
conformable antenna according to an exemplary embodiment of the
present invention.
[0022] Throughout the drawings, like reference numerals will be
understood to refer to like parts, components, and structures.
DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
[0023] The following description with reference to the
accompanying drawings is provided to assist in a comprehensive
understanding of exemplary embodiments of the invention as defined
by the claims and their equivalents. It includes various specific
details to assist in that understanding but these are to be
regarded as merely exemplary. Accordingly, those of ordinary skill
in the art will recognize that various changes and modifications
of the embodiments described herein can be made without departing
from the scope and spirit of the invention. In addition,
descriptions of well-known functions and constructions are omitted
for clarity and conciseness.
[0024] The terms and words used in the following description and
claims are not limited to the bibliographical meanings, but, are
merely used by the inventor to enable a clear and consistent
understanding of the invention. Accordingly, it should be apparent
to those skilled in the art that the following description of
exemplary embodiments of the present invention are provided for
illustration purpose only and not for the purpose of limiting the
invention as defined by the appended claims and their equivalents.
[0025] It is to be understood that the singular forms "a," "an,"
and "the" include plural referents unless the context clearly
dictates otherwise. Thus, for example, reference to "a component
surface" includes reference to one or more of such surfaces.
[0026] As used herein, the term "substantially" refers to the
complete or nearly complete extent or degree of an action,
characteristic, property, state, structure, item, or result. For
example, an object that is "substantially" enclosed would mean
that the object is either completely enclosed or nearly completely
enclosed. The exact allowable degree of deviation from absolute
completeness may in some cases depend on the specific context.
However, generally speaking the nearness of completion will be so
as to have the same overall result as if absolute and total
completion were obtained. The use of "substantially" is equally
applicable when used in a negative connotation to refer to the
complete or near complete lack of an action, characteristic,
property, state, structure, item, or result.
[0027] As used herein, the term "about" is used to provide
flexibility to a numerical range endpoint by providing that a
given value may be "a little above" or "a little below" the
endpoint.
[0028] As used herein, the term "antenna" refers to a transducer
used to transmit or receive electromagnetic radiation. That is, an
antenna converts electromagnetic radiation into electrical signals
and vice versa. Electromagnetic radiation is a form of energy that
exhibits wave-like behavior as it travels through space. In free
space, electromagnetic radiation travels close to the speed of
light with very low transmission loss. Electromagnetic radiation
is absorbed when propagating through a conducting material.
However, when encountering an interface of such a material, the
electromagnetic radiation is partially reflected and partially
transmitted there-though. Herein, exemplary embodiments of the
present invention described below are directed toward techniques
that allow for a more efficient interface by reducing the
reflections at the interface.
[0029] In addition, exemplary embodiments of the present invention
described below relate to techniques for a conductive particle
based material used for at least one of propagation, emission and
absorption of electromagnetic radiation. While the techniques for
the conductive particle based material may be described below in
various specific implementations, the present invention is not
limited to those specific implementations and is similarly
applicable to other implementations.
[0030] An initial overview of the conductive particle based
material is provided below and then specific implementations in
which the conductive particle based material is employed are
described in detail further below. This initial overview of the
conductive particle based material is intended to aid readers in
understanding the conductive particle based material that is the
basis of various exemplary implementations, but is not intended to
identify key features or essential features of those various
exemplary implementations, nor is it intended to limit the scope
of the claimed subject matter.
Conductive Particle Based Material
[0031] In one exemplary embodiment, a conductive particle based
material is employed. The conductive particle based material
includes at least two constituent components, namely conductive
particles and a binder. However, the conductive particle based
material may include additional components, such as at least one
of graphite, carbon (e.g., carbon black), titanium dioxide, etc.
[0032] The conductive particles may be any conductive material,
such as silver, copper, nickel, aluminum, steel, metal alloys,
carbon nanotubes, any other conductive material, and any
combination thereof. For example, in one exemplary embodiment, the
conductive particles are silver coated copper. Alternatively, the
conductive particles may be a combination of a conductive material
and a non-conductive material. For example, the conductive
particles may be ceramic magnetic microspheres coated with a
conductive material such as any of the conductive materials
described above. Furthermore, the composition of each of the
conductive particles may vary from one another.
[0033] The conductive particles may be any shape from a random
non-uniform shape to a geometric structure. The conductive
particles may all have the same shape or the conductive particles
may vary in shape from one another. For example, in one exemplary
embodiment, each of the conductive particles may have a random
non-uniform shape that varies from conductive particle to
conductive particle.
[0034] The conductive particles may range in size from a few
nanometers up to a few thousand nanometers. Alternatively, the
conductive particles may range in size from about 400 nanometers
to 30 micrometers. The conductive particles may be substantially
similar in size or may be of various sizes included in the above
identified ranges. For example, in one exemplary embodiment, the
conductive particles are of various sizes in the range of about
400 nanometers to 30 micrometers. Herein, when a range of sizes of
the conductive particles are employed, the distribution of the
sizes may be uniform or non-uniform across the range. For example,
75% of the conductive particles may be a larger size within a
given range while 25% of the conductive particles are a smaller
size.
[0035] An effective amount of conductive particles are included
relative to the binder so that the conductive particles are
dispersed in the binder. The conductive particles may be randomly
or orderly dispersed in the binder. The conductive particles may
be dispersed at uniform or non-uniform densities. The conductive
particles may be dispersed so that at least a majority of the
conductive particles are closely adjacent to, but do not touch,
one another.
[0036] The binder is used to substantially fix the conductive
particles relative to each other and should be a non-conductive or
semi-conductive substance. Any type of conventional or novel
binder that meets these criteria may be used. The non-conductive
or semi-conductive material of the binder may be chosen to
function as a dielectric with a given permittivity.
[0037] The conductive particle based material may be formed as a
rigid or semi-rigid structure. For example, the conductive
particle based material may be a plastic sheet having the
conductive particles dispersed therein. The conductive particle
based material may be clear or opaque, and may include any shade
of color.
[0038] In addition, the conductive particle based material may be
a liquid, paint, gel, ink or paste that dries or cures. Here, the
binder may include distillates, hardening agents, or solvents such
as a Volatile Organic Compound (VOC). In this case, the conductive
particle based material may be applied to a substrate. Also, when
the conductive particle based material is a liquid, paint, gel,
ink or paste that dries or cures, the binder may adhere to the
substrate. The conductive particle based material may be spayed
on, brushed on, rolled on, ink-jet printed, silk screened, etc.
onto the substrate. The use of the conductive particle based
material that is a liquid, paint, gel, ink or paste that dries or
cures is advantageous in that the conductive particle based
material may be thinly applied to a substrate and conform to the
surface of the substrate. This allows the conductive particle
based material to occupy very little space and, in effect, blend
into the substrate.
[0039] The substrate may be the surface of any conductive,
non-conductive or semi-conductive substance. The substrate may be
rigid, semi-flexible or flexible. The substrate may be flat,
irregularly shaped or geometrically shaped. The substrate may be
paper, cloth, plastic, polycarbonate, acrylic, nylon, polyester,
rubber, metal such as aluminum, steel and metal alloys, glass,
composite materials, fiber reinforced plastics such as fiberglass,
polyethylene, polypropylene, fiberglass, textiles, wood, etc.
[0040] The substrate may have a coating applied thereto. The
coating may be a conductive, non-conductive or semi-conductive
substance. The coating may be a paint, gel, ink, paste, tape, etc.
The coating may be chosen to function as a dielectric with a given
permittivity.
[0041] At least one of a protective and concealing (or decorative)
coating may be applied over the conductive particle based material
once it has been applied to a substrate.
[0042] An example of the conductive particle based material is
described below with reference to FIG. 1.
[0043] FIG. 1 is a captured image of a conductive particle based
material according to an exemplary embodiment of the present
invention.
[0044] Referring to FIG. 1, the conductive particle based material
includes conductive particles and a binder. The conductive
particles are randomly shaped, sized and located. However,
conductive particles are dispersed so that at least a majority of
the conductive particles are closely adjacent to, but do not
touch, one another.
[0045] Herein, without intending to be limiting, for a conductive
particle based material of a given density of conductive
particles, the conductive particle based material may be applied
at a thickness such that the conductive particles are dispersed in
the binder so that at least a majority of the conductive particles
are closely adjacent to, but do not touch, one another. Herein,
without intending to be limiting, it has been observed that a
conductive particle based material has a resistance of about 3-17
ohms across any given two points on the surface.
[0046] Herein, without intending to be limiting, it has been
observed that when the conductive particle based material is
formulated such that the conductive particles are dispersed in the
binder so that at least a majority of the conductive particles are
closely adjacent to, but do not touch, one another, the conductive
particle based material exhibits properties that enable it to at
least one of efficiently propagate electromagnetic radiation,
efficiently absorb electromagnetic radiation from space, and
efficiently emit electromagnetic radiation into space. Moreover,
it has been observed that those properties may be either
supplemented or enhanced by including an effective amount of
carbon, such as carbon black, in the conductive particle based
material. For example, an effective amount of carbon black may be
an amount that corresponds to about 1-7% of the conductive
particles included in the conductive particle based material.
[0047] Without intending to be limiting, it is believed that when
electromagnetic radiation is introduced into the conductive
particle based material, electromagnetic radiation may pass from
conductive particle to conductive particle via at least one of
capacitive and inductive coupling. Here, the binder may function
as a dielectric. Thus, it is believed that the conductive particle
based material may act as an array of capacitors, which may be at
least part of the reason why the conductive particle based
material at least one of efficiently propagates electromagnetic
radiation, efficiently absorbs electromagnetic radiation from
space, and efficiently emits electromagnetic radiation into space.
[0048] Alternatively or additionally, and without intending to be
limiting, it is believed that the properties that enable the
conductive particle based material to at least one of efficiently
propagate electromagnetic radiation, efficiently absorb
electromagnetic radiation from space, and efficiently emit
electromagnetic radiation into space, may be explained by quantum
theory at the atomic level.
[0049] Herein, without intending to be limiting, it has been
observed that the conductive particle based material generates
electrical energy when exposed to sunlight.
[0050] Herein, without intending to be limiting, it has been
observed that the resistance of the conductive particle based
material continuously changes over time. Herein, without intending
to be limiting, it has been observed that, when energized with a
radio signal, the conductive particle based material has
infinitely low resistance to that signal.
[0051] Herein, while the present disclosure is described in the
context of electromagnetic radiation, without intending to be
limiting, it is believed that the present invention is equally
applicable to bioelectromagnetic energy. Thus, any disclosure
herein that refers to electromagnetic radiation equally applies to
bioelectromagnetic energy.
Conductive Particle Based Antenna
[0052] In one exemplary embodiment, the conductive particle based
material is employed to implement a conductive particle based
antenna. When used as a conductive particle based antenna, the
conductive particle based antenna is fabricated using the
conductive particle based material. Here, the conductive particle
based material may be formed into a shape that conforms to the
desired characteristics of the antenna. For example, the shape and
size of the antenna may vary depending on the frequency and/or
polarization of the electromagnetic radiation to be communicated.
The conductive particle based antenna is at least one of
electrically, capacitively, and inductively coupled to at least
one of a receiver, a transmitter, and a transceiver at a coupling
point of the conductive particle based antenna. The coupling point
of the conductive particle based antenna may substantially be an
end point of the conductive particle based antenna. The coupling
point of the conductive particle based antenna may be coupled to a
coupling point of a feed line electrically connected to the
receiver, transmitter, or transceiver. When capacitively or
inductively coupled, the coupling may occur through a distance
that includes an air gap or that has a substance, such as glass,
disposed therein.
[0053] When a conductive particle based antenna is fabricated
using the conductive particle based material, the conductive
particle based antenna may exhibit a broad bandwidth self-tuning
characteristic by using only a small section of the conductive
particle based antenna to emit the electromagnetic radiation into
space.
[0054] In addition, when the conductive particle based antenna is
fabricated using the conductive particle based material, there may
be no or little I<2>R losses due the small practical size
and the majority of the particles not contacting each other. In
addition, there may be no or little Radio Frequency (RF) skin
effect losses due to the small practical size. Once the signal is
coupled to the conductive particle based antenna, the conductive
particle based antenna provides little to no resistance to the
transmission signal and it is emitted without significant loss
into space. The same may happen in reverse for receiving. That is,
the received signal may be absorbed and delivered with little to
no loss to the coupling device and is then propagated down a feed
line to a receiver.
[0055] An example of the conductive particle based antenna is
described below with reference to FIG. 2.
[0056] FIG. 2 illustrates a conductive particle based antenna
according to an exemplary embodiment of the present invention. The
particular structure of the conductive particle based antenna 200
shown in FIG. 2 is merely an example used for explanation and is
not intended to be limiting. The conductive particle based
material used to fabricate the conductive particle based antenna
200 of FIG. 2 is assumed to be formulated as a liquid, paint, gel,
ink, or paste that dries or cures.
[0057] Referring to FIG. 2, the conductive particle based antenna
200 includes a substrate 210, a first antenna segment 220A, a
second antenna segment 220B, a first coupler 230A, a second
coupler 230B, and a feed line 240.
[0058] The substrate 210 is a rigid flat sheet of a non-conductive
material, such as plexiglass. However, any other surface may be
chosen as substrate 210. For example, the surface of a vehicle,
the wall of a building, the casing of a wireless device, glass, a
tree, cloth, a rock, a plastic sheet, etc., may be chosen as the
substrate. When a conductive material is chosen as the substrate
210, an insulative coating of a non-conductive or semi-conductive
material may be applied to the area of the substrate 210 where the
conductive particle based antenna 200 is to be applied. Examples
of the insulative coating of the non-conductive or semi-conductive
material include plastic tape, paper tape, paint, etc. Also, when
the substrate 210 is a conductive material, the substrate may be
utilized as a ground plane. In addition, a surface preparation
coating may be applied to the substrate 210 that allows for better
adhesion of the conductive particle based material to the
substrate 210. The insulative coating may serve the same function
as the surface preparation coating. Also, the surface preparation
coating may be applied beneath or on top of the insulative
coating. Furthermore, the surface preparation coating may be used
when the insulative coating in not applied.
[0059] The first antenna segment 220A and the second antenna
segment 220B are applied to the substrate 210 according to a
desired design. Here, the first antenna segment 220A is
functioning as an active antenna element and the second antenna
segment 220B is functioning as a ground plane. When the substrate
210 is functioning as a ground plane or an earth ground is
employed, the second antenna segment 220B may be omitted. Here,
the first antenna segment 220A and the second antenna segment 220B
are formed using a conductive particle based material formulated
as a liquid, paint, gel, ink, or paste that dries or cures. The
non-conductive material may be sprayed on, brushed on, rolled on,
silk screened, ink jet printed, etc.
[0060] The first coupler 230A and the second coupler 230B at least
one of electrically, capacitively, and inductively couple to the
first antenna segment 220A and the second antenna segment 220B,
respectively. In addition, the first coupler 230A and the second
coupler 230B adhere to, or are otherwise in a fixed relationship
with, the first antenna segment 220A and the second antenna
segment 220B. The first coupler 230A and the second coupler 230B
are electrically connected to respective portions of the feed line
240.
[0061] The feed line 240 is electrically connected to first
coupler 230A and the second coupler 230B. Also, the feed line 240
is electrically connected to at least one of a receiver, a
transmitter, and a transceiver.
[0062] An example of a structure of a conductive particle based
antenna is described below with reference to FIG. 3.
[0063] FIG. 3 illustrates a structure of a conductive particle
based antenna according to an exemplary embodiment of the present
invention. The particular structure of the conductive particle
based antenna shown in FIG. 3 is merely an example used for
explanation and is not intended to be limiting. The conductive
particle based material used to fabricate the conductive particle
based antenna of FIG. 3 is assumed to be formulated as a liquid,
paint, gel, ink, or paste that dries or cures.
[0064] Referring to FIG. 3, the conductive particle based antenna
includes a substrate 310, first coating 350, conductive particle
based material coating 320, and a second coating 360. One or more
of the substrate 310, the first coating 350, and the second
coating 360 may be omitted. In addition, one or more additional
coatings may be utilized.
[0065] The substrate 310 may be any surface of any object,
regardless of what material(s) the object is constructed of. For
example, the surface of a vehicle, the wall of a building, the
casing of a wireless device, glass, a tree, cloth, a rock, a
plastic sheet, etc., may be chosen as the substrate. When the
substrate 310 is a conductive material, the substrate 310 may
function as a ground plane.
[0066] The first coating 350 is applied on top of the substrate
310. The first coating 350 may be at least one of an insulative
coating and a surface preparation coating. As an insulative
coating, the first coating 350 may be a non-conductive or
semi-conductive material. Examples of the insulative coating of
the non-conductive or semi-conductive material include plastic
tape, paper tape, paint, etc. As a surface preparation coating,
the first coating 350 may be any material that allows for better
adhesion of the conductive particle based material coating 320 to
the substrate 310. The same coating may serve as both the
insulative coating and a surface preparation coating.
Alternatively, separate insulative and a surface preparation
coatings may be utilized either together or individually. The
first coating 350 may be formulated as a liquid, paint, gel, ink,
or paste that dries or cures. In this case, the first coating 350
may be sprayed on, brushed on, rolled on, silk screened, ink jet
printed, etc. The first coating 350 may be omitted.
[0067] The conductive particle based material coating 320 is
applied on top of the first coating 350, if present. Otherwise,
the conductive particle based material coating 320 is applied on
top of the substrate 320. Alternatively, the conductive particle
based material coating 320 may be an independent structure. The
conductive particle based material coating may be formulated using
any formulation of the conductive particle based material
described herein. For example, the conductive particle based
material coating 320 may be formulated as a liquid, paint, gel,
ink, or paste that dries or cures. In this case, the
non-conductive material may be sprayed on, brushed on, rolled on,
silk screened, ink jet printed, etc.
[0068] The second coating 360, if utilized, is applied on top of
the conductive particle based material coating 320. The second
coating 360 may serve to protect and/or conceal the conductive
particle based material coating 320. The second coating 360 may be
any material or structure that protects and/or conceals the
conductive particle based material coating 320. The same coating
may serve as both the protective coating and the concealment
coating. Alternatively, separate protective and concealment
coatings may be utilized either together or individually. In one
exemplary embodiment, the second coating 360 is formulated as a
liquid, paint, gel, ink, or paste that dries or cures. In this
case, the second coating 360 may be sprayed on, brushed on, rolled
on, silk screened, ink jet printed, etc. The second coating 360
may be omitted.
[0069] Tests were conducted to compare the conductive particle
based antenna to a conventional antenna. The conductive particle
based antenna was formed using the conductive particle based
material whereas the conventional copper antenna was formed using
solid copper strips. Both the conductive particle based antenna
and the conventional copper antenna were fabricated with the same
shape (i.e., the shape shown in FIG. 2) of the same size so that
the effect of the particular structure, if any, is equal to both
antennas. A non-conductive plexiglass substrate was used to fix
both antennas. The same transmit power and frequency were used for
the test. The frequency selected was in the range of about 460
MHz. Testing equipment included a Yeasu FT 7900 Dual band FM
transceiver, a Telewave Model 44 Wattmeter, and a FieldFox Model
N9912A Portable Network Analyzer operated in SA mode used with a
Yeasu Model Rubber Duck Antenna that was located 160 feet from the
test antennas. The test data for the conventional copper antenna
and the conductive particle based antenna are provided below in
Table 1.
[0000]
TABLE 1
Conventional Copper Conductive Particle
Antenna Based Antenna
Forward Power 22 watts 41 watts
Reverse Power 12 watts 1 watt
Relative Signal -35 decibels -26
decibels
Strength
[0070] As can be seen in Table 1, the conductive particle based
antenna exhibits a significantly higher forward power (i.e., 41
watts) than the forward power of the conventional copper antenna
(i.e., 22 watts). This can be explained by the conductive particle
based antenna exhibiting a significantly lower reverse power
(i.e., 1 watt) than the reverse power of the conventional copper
antenna (i.e., 12 watts). Accordingly, the resulting relative
signal strength of the conductive particle based antenna is higher
(-26 decibels) than the resulting relative signal strength of the
conventional copper antenna (-35 decibels).
[0071] As can be gleaned from the test, for a given antenna
structure, the conductive particle based antenna is more efficient
at emitting electromagnetic radiation into space than the
conventional copper antenna. Therefore, the conductive particle
based antenna has a higher effective gain than the conventional
copper antenna. Also, since there is less reverse power, less of
the electromagnetic radiation input to the conductive particle
based antenna may be converted into heat. Thus, the antenna may
operate at a lower temperature for a given input power and
therefore may have a higher power rating.
[0072] The added gain by using the conductive particle based
antenna is well suited to any application in which higher gain
and/or lower transmit power for a given antenna structure is
desired.
[0073] It has been observed that the transmission performance of
the conductive particle based antenna varies depending on the type
of amplifier used to drive the antenna. For example, the
transmitter used in the Yeasu FT 7900 Dual band FM transceiver in
the above test is a class C amplifier. When a linear class A
amplifier is employed, the transmission performance of the
conductive particle based antenna is reduced and approaches that
of the conventional copper antenna. Thus, the performance of the
conductive particle based antenna is greater when used with an
amplifier that operates for less than the entire input cycle, such
as the class C amplifier. While a class C amplifier is referred to
herein for convenience in explanation, the use of any amplifier
that operates for less than the entire input cycle is equally
applicable.
[0074] Herein, power constrained devices typically employ a class
C amplifier in order to take advantage of their efficiency so as
to conserve power. Similarly, the use of the conductive particle
based antenna in power constrained devices that employ a class C
amplifier takes advantage of the efficiency of the conductive
particle based antenna so as to further conserve power. The power
conservation gained by the power constrained devices by using the
conductive particle based antenna may allow for longer operational
times and/or smaller power source (e.g., batteries) (and thereby
smaller devices and/or a lower cost).
Conductive Particle Based Antenna Enhancer
[0075] In one exemplary embodiment, the conductive particle based
material is employed to implement a conductive particle based
antenna enhancer. When used as a conductive particle based antenna
enhancer, the conductive particle based antenna enhancer is
fabricated using the conductive particle based material. Here, the
conductive particle based antenna enhancer is disposed in an
adjacent offset relationship to a conventional antenna with a
non-conductive or semi-conductive material disposed there between.
Alternatively or additionally, an air gap between the conventional
antenna and the conductive particle based antenna enhancer may be
employed. Here, the conventional antenna is electrically coupled
to at least one of a receiver, a transmitter, and a transceiver.
[0076] In this configuration, the conductive particle based
antenna enhancer is at least one of capacitively and inductively
coupled to the conventional antenna. Herein, the electromagnetic
radiation that is capacitively and inductively coupled from the
conventional antenna to the conductive particle based antenna
enhancer is efficiently radiated into space by the conductive
particle based antenna enhancer.
[0077] The conductive particle based antenna enhancer may be
fabricated and positioned so as to be adjacent and offset from the
conventional antenna. For example, the conductive particle based
antenna enhancer may be added or built into a structure that
places it in an adjacent and offset relationship to the
conventional antenna.
[0078] For example, the structure may create an air gap between
the conventional antenna and a surface onto which the conductive
particle based material is applied. The structure may be
constructed of a nonconductive material. Alternatively, the
structure may be constructed of a conductive material and at least
partially coated with a nonconductive material. If the structure
is constructed of a conductive material, the conductive particle
based material may be applied on top of the nonconductive material
coating the structure. Herein, the conductive particle based
material may be applied to a side of the structure closest to the
conventional antenna or a side of the structure furthest from the
conventional antenna. The conductive particle based material may
be coated with a layer of the nonconductive material or another
material. Examples of the structure include a housing of a device
(e.g., a housing of a wireless device), an enclosure placed over
the existing antenna, and a case placed over a housing of a device
(e.g., a protective cover for a wireless device). The conductive
particle based material is at least one of capacitively and
inductively coupled to the conventional antenna and thereby
increases the performance of the conventional antenna. Here, the
thickness the nonconductive material and/or air gap directly
affects the performance gain of the conductive particle based
antenna enhancer and if the nonconductive thickness and/or air gap
is too large, performance may decrease. The thickness of the air
gap and/or nonconductive material is very small in relationship to
the wavelength of the frequency the conventional antenna is
designed for. In a specific example of the exemplary
implementation described above, a conventional bumper case for an
iPhone, which is manufactured by Apple, may have the conductive
particle based material applied to a portion thereof that is
adjacent to the antenna of the iPhone (the surface that is
concealed when the iPhone is installed therein). Here, the
conductive particle based material may have a layer of
nonconductive material applied on top.
[0079] Another example of an implementation of a conductive
particle based antenna enhancer is described below with reference
to FIG. 4.
[0080] FIG. 4 illustrates an implementation of a conductive
particle based antenna enhancer according to an exemplary
embodiment of the present invention. The particular structure of
the conductive particle based antenna shown in FIG. 4 is merely an
example used for explanation and is not intended to be limiting.
The conductive particle based material used to fabricate the
conductive particle based antenna enhancer of FIG. 4 is assumed to
be formulated as a liquid, paint, gel, ink, or paste that dries or
cures.
[0081] Referring to FIG. 4, a wireless device 480 and a protective
cover 490 are shown. The wireless device 480 includes an internal
antenna 470. The protective cover 490 includes a conductive
particle based antenna enhancer 420 that is disposed so as to be
adjacent to the internal antenna 470 when the wireless device 480
is disposed in the protective cover 490.
[0082] While the conductive particle based antenna enhancer 420 is
shown to correspond to the size of the internal antenna 470, the
conductive particle based antenna enhancer 420 may be smaller or
larger than the internal antenna 470. In addition, while the
conductive particle based antenna enhancer 420 is shown as being
disposed immediately adjacent to the internal antenna, the
conductive particle based antenna enhancer 420 may be disposed at
a different location on the protective cover 490.
[0083] While the conductive particle based antenna enhancer 420 is
shown as being applied to an inner surface of the protective cover
490, the conductive particle based antenna enhancer 420 may be
applied to an outer surface of, or may be disposed within, the
protective cover 490. When the conductive particle based antenna
enhancer 420 is disposed within the protective cover 490, the
material used to construct the protective cover 490 may serve as
the binder for the conductive particle based material. When, the
conductive particle based antenna enhancer 420 is disposed at an
inner or outer surface of the conductive particle based material,
one or more of an insulative coating, a surface preparation
coating, a protective coating, and a concealment coating may be
used. In addition, the conductive particle based antenna enhancer
420 may be formed as an independent structure (with or without a
substrate) that is fixed to the protective cover 490.
[0084] The conductive particle based antenna enhancer may be added
to an existing conventional antenna or may be added at the time
the conventional antenna is fabricated.
[0085] In one exemplary embodiment, the conductive particle based
antenna enhancer is used to coat a conventional antenna that has
been coated with a non-conductive material. The coating of the
non-conductive material may be implemented as a liquid, paint,
gel, ink, or paste that dries or cures. Herein, the non-conductive
material may be sprayed on, brushed on, rolled on, silk screened,
ink jet printed, etc. Alternatively, the coating of the
non-conductive material may be a film or tape that is applied to
the conventional antenna. Layers of other materials may be
disposed between the conventional antenna and the non-conductive
material and/or between the non-conductive material and the
conductive particle based material. Here, depending on the
configuration, the conductive particle based material may be
coated with a layer of the nonconductive material and/or another
material. Here, the thickness the non-conductive material may
directly affect the performance gain of the conductive particle
based material and if the thickness of the non-conductive material
is too large, performance may decrease. The thickness of the
non-conductive material is very small in relationship to the
wavelength of the frequency the conventional antenna is designed
for.
[0086] An example of a structure of a coated conductive particle
based antenna enhancer is described below with reference to FIG.
5.
[0087] FIG. 5 illustrates a structure of a coated conductive
particle based antenna enhancer according to an exemplary
embodiment of the present invention. The particular structure of
the conductive particle based antenna shown in FIG. 5 is merely an
example used for explanation and is not intended to be limiting.
The conductive particle based material used to fabricate the
conductive particle based antenna of FIG. 5 is assumed to be
formulated as a liquid, paint, gel, ink, or paste that dries or
cures.
[0088] Referring to FIG. 5, the coated conductive particle based
antenna includes a conventional antenna 570, a first coating 550,
a conductive particle based material coating 520, and a second
coating 560. One or more of the first coating 550, and a second
coating 560 may be omitted. In addition, one or more additional
coatings may be utilized.
[0089] The conventional antenna 570 may be any surface of any
conventional antenna, which in this example, is assumed to be
constructed of a conductive material such as metal.
[0090] The first coating 550 is applied on top of the conventional
antenna 570. The first coating 550 may be at least one of an
insulative coating and a surface preparation coating. As an
insulative coating, the first coating 550 may be a non-conductive
or semi-conductive material. Examples of the insulative coating of
the non-conductive or semi-conductive material include plastic
tape, paper tape, paint, etc. As a surface preparation coating,
the first coating 550 may be any material that allows for better
adhesion of the conductive particle based material coating 520 to
the conventional antenna 570. The same coating may serve as both
the insulative coating and a surface preparation coating.
Alternatively, separate insulative and a surface preparation
coatings may be utilized either together or individually. The
first coating 550 may be formulated as a liquid, paint, gel, ink,
or paste that dries or cures. In this case, the first coating 550
may be sprayed on, brushed on, rolled on, silk screened, ink jet
printed, etc. The first coating 550 may be omitted.
[0091] The conductive particle based material coating 520 is
applied on top of the first coating 550, if present. Otherwise,
the conductive particle based material coating 320 is applied on
top of the conventional antenna 570. The conductive particle based
material coating may be formulated using any formulation of the
conductive particle based material described herein. For example,
the conductive particle based material coating 520 may be
formulated as a liquid, paint, gel, ink, or paste that dries or
cures. In this case, the non-conductive material may be sprayed
on, brushed on, rolled on, silk screened, ink jet printed, etc.
[0092] The second coating 560, if utilized, is applied on top of
the conductive particle based material coating 520. The second
coating 560 may serve to protect and/or conceal the conductive
particle based material coating 520. The second coating 560 may be
any material or structure that protects and/or conceals the
conductive particle based material coating 520. The same coating
may serve as both the protective coating and the concealment
coating. Alternatively, separate protective and concealment
coatings may be utilized either together or individually. In one
exemplary embodiment, the second coating 560 is formulated as a
liquid, paint, gel, ink, or paste that dries or cures. In this
case, the second coating 560 may be sprayed on, brushed on, rolled
on, silk screened, ink jet printed, etc. The second coating 560
may be omitted.
[0093] The conductive particle based antenna enhancer may be
fabricated and positioned so as to be adjacent and offset from all
or a portion of the conventional antenna. For example, the
conductive particle based antenna enhancer may be fabricated and
positioned so as to be adjacent to a portion of the conventional
antenna corresponding to half or a quarter of the desired
wavelength.
[0094] An example of an antenna partially coated with a conductive
particle based antenna enhancer is described below with reference
to FIG. 6.
[0095] FIG. 6 illustrates an antenna partially coated with a
conductive particle based antenna enhancer according to an
exemplary embodiment of the present invention. The particular
structure of the antenna partially coated with the conductive
particle based antenna enhancer shown in FIG. 6 is merely an
example used for explanation and is not intended to be limiting.
The conductive particle based material used to fabricate the
conductive particle based antenna of FIG. 6 is assumed to be
formulated as a liquid, paint, gel, ink, or paste that dries or
cures.
[0096] Referring to FIG. 6, an antenna 670 that is connected to a
feed line 640 is shown. The antenna 670 is partially coated with a
conductive particle based antenna enhancer 620. As can be seen,
the conductive particle based antenna enhancer 620 coats about a
quarter of the antenna 670.
[0097] Tests were conducted to compare a conventional copper
antenna to the conventional copper antenna with the conductive
particle based antenna enhancer. In particular, the same equipment
and testing conditions as the test described above with respect to
the conductive particle based antenna were performed. Here,
insulative tape was applied to the entirety of the conventional
copper antenna and the conductive particle based material was then
applied onto the insulative tape.
[0098] The test data for the conventional copper antenna and the
conventional copper antenna that has been enhanced with the
conductive particle based antenna enhancer are provided below in
Table 2.
[0000]
TABLE 2
Conventional Copper Antenna with
Conventional Conductive Particle Based Antenna
Copper Antenna Enhancer
Forward Power 22 watts 28 watts
Reverse Power 12 watts 10 watts
Relative Signal -35 decibels -27 decibels
Strength
[0099] As can be seen in Table 2, the conventional copper antenna
with the conductive particle based antenna enhancer exhibits a
significantly higher forward power (i.e., 28 watts) than the
forward power of the conventional copper antenna alone (i.e., 22
watts). This can be explained by the conventional copper antenna
with the conductive particle based antenna enhancer exhibiting a
significantly lower reverse power (i.e., 10 watts) than the
reverse power of the conventional copper antenna alone (i.e., 12
watts). Accordingly, the resulting relative signal strength of the
conventional copper antenna with the conductive particle based
antenna enhancer is higher (-27 decibels) than the resulting
relative signal strength of the conventional copper antenna (-35
decibels).
[0100] As can be gleaned from the above identified test, the
conventional copper antenna with the conductive particle based
antenna enhancer is more efficient at emitting electromagnetic
signals into space than the conventional copper antenna alone.
Therefore, the conventional copper antenna with the conductive
particle based antenna enhancer has a higher effective gain than
the conventional copper antenna alone. Also, since there is less
reverse power, less of the electromagnetic radiation input to the
conventional copper antenna with the conductive particle based
antenna enhancer will be converted into heat. Thus, the
conventional copper antenna with the conductive particle based
antenna enhancer may operate at a lower temperature for a given
input power and therefore may have a higher power rating.
[0101] Accordingly, the conductive particle based material may be
used to enhance a conventional antenna.
Conductive Particle Based Transmission Line
[0102] The conductive particle based material may be used to form
a conductive particle based transmission line. To implement a
conductive particle based transmission line, a transmission line
is formed in any of the various ways described herein for forming
an object using the conductive particle based material. Herein, at
least some of the properties that enable the conductive particle
based material to efficiently radiate electromagnetic radiation
into space allow the conductive particle based material to
efficiently radiate electromagnetic radiation down the
transmission line formed using the conductive particle based
material. The use of the conductive particle based material as a
transmission line is beneficial due to its lower resistance and
heat generation.
Conductive Particle Based Electromagnetic Radiation
Harvester
[0103] The conductive particle based material may be used as an
electromagnetic radiation harvester. The high efficiencies of the
conductive particle based material in at least one of propagating
and absorbing electromagnetic radiation make it ideally suited for
use in collecting electromagnetic radiation. While such collected
electromagnetic radiation may be electromagnetic radiation that
was transmitted with the intention of being harvested by the
electromagnetic radiation harvester, the collected electromagnetic
radiation may be background electromagnetic radiation. Herein, the
electromagnetic radiation harvester may be coupled to a receiver
that collects the energy absorbed by the electromagnetic radiation
harvester. The electromagnetic radiation harvester is formed in
any of the various ways described herein for forming an object
using the conductive particle based material.
Conductive Particle Based Conformable Antenna
[0104] The conductive particle based material may be used to
construct a conductive particle based conformable antenna. The
benefit of the conductive particle based conformable antenna may
be easily appreciated when considered in the context of an
exemplary use case, which is described below.
[0105] According to the exemplary use case, the conductive
particle based conformable antenna may use used in a military
setting. The Special Operations community has a major logistical
and safety issue when it comes to communications in the theater.
The US Department of Defense (DoD) has rapidly expanded its
communications capabilities within the radio spectrum. In the
past, two way radios in a variety of form factors where used for
conventional Push-To-Talk (PTT) communications. The use of these
systems has now evolved into a true "Digital Battlefield"
consisting of a multitude of communications platforms. Vast arrays
of data networks came into reality. The scope of radios used today
varies widely from conventional voice to Satellite, mesh networks,
to Unmanned Aerial Vehicles (UAVs) and unattended ground sensors.
[0106] The reason this wide variety of systems is mentioned is to
give an understanding of why the conductive particle based
conformable antenna may be beneficial to the mission of soldiers.
Every RF device utilized by the military operates on a wide range
of frequencies and a different type of transmission (Amplitude
Modulation (AM), Frequency Modulation (FM), Satcom, Single Side
band, etc.).
[0107] However, conventional antenna systems are designed and
tuned for a limited range of frequencies and are generally
designed to work with only one of the hundreds of types of radio
devices on the market. The other major downsides to these
conventional antenna systems are the logistics of getting them
into battle. They are heavy, bulky, expensive, and difficult to
transport. Accordingly, there is a need to address the
shortcomings of the conventional antenna systems.
[0108] The conductive particle based conformable antenna addresses
the shortcomings of the conventional antenna systems by being
operable with any and all of the radios currently deployed and
being developed. As opposed to being an antenna of fixed form, the
conductive particle based conformable antenna may instead be
constructed on an as needed basis.
[0109] For example, the conductive particle based conformable
antenna may be constructed on site using the conductive particle
based material. In this case, the conductive particle based
material is a liquid, paint, gel, ink or paste that dries or
cures. Herein, the conductive particle based conformable antenna
may be applied to a substrate. In particular, the conductive
particle based material may be sprayed on, brushed on, rolled on,
silk screened, ink jet printed, etc.
[0110] The conductive particle based conformable antenna may be
designed based on typical antenna design, theory, and formulas.
The antenna design may be generated in advance or at the time the
antenna is needed based on desired characteristics.
[0111] The conductive particle based material is applied to the
substrate to form the conductive particle based conformable
antenna based on the desired antenna design.
[0112] The substrate may be any surface of any material, such as
acrylic, ABS, structural foams, solvent sensitive materials such
as polycarbonate and polystyrene, and non-porous surfaces
including primed wallboard, wood and clean metals, etc.
[0113] When the substrate is a conducting material, a
non-conductive or semi-conductive coating may first be applied to
the substrate. In this case, the conducting material may serve as
a ground plane. When the substrate is a non-conducting material, a
ground plane can be accomplished by using the earth's natural
ground. Alternatively, the ground plane can be accomplished by
fabricating an independent ground plane.
[0114] Once the antenna is fabricated, a feed line is coupled to
the conductive particle based conformable antenna and an RF
communications device. The conductive particle based conformable
antenna is at least one of electrically, capacitively, and
inductively coupled to a coupling point of the feed line. The
conductive particle based conformable antenna may be coupled to
the coupling point of the feed line at an end point of the
conductive particle based conformable antenna. When capacitively
or inductively coupled, the coupling may occur through a distance
that includes an air gap or a substance, such as glass.
[0115] To fabricate the conductive particle based conformable
antenna, a template of the desired antenna design may be used. The
template may be a sheet formed of any rigid or semi-rigid material
in which the desired design of the antenna is cut out.
[0116] An example of a template used to fabricate a conductive
particle based conformable antenna is described below with
reference to FIG. 7.
[0117] FIG. 7 illustrates a template used to fabricate a
conductive particle based conformable antenna according to an
exemplary embodiment of the present invention.
[0118] Referring to FIG. 7, a template 700 is shown. The template
700 may be any material that may be used to form a template or
stencil. For example, the template 700 may be a sheet formed of a
rigid or semi-rigid material. The cut out of the template 700 may
be at least one of a positive and a negative of a desired design
of an antenna. The template 700 may be an image displayed on a
surface showing where conductive particle based material should or
should not be applied. The template 700 may be an image displayed
on a display or in a guide book that shows a desired design of an
antenna. Herein, the template 700 shown in FIG. 7 corresponds to
the antenna design shown in FIG. 2.
[0119] Examples of various cutout designs for the template 700 are
found in U.S. Design patent application Ser. No. 29/390,425, filed
on Apr. 25, 2011, and entitled "ANTENNA"; U.S. Design patent
application Ser. No. 29/390,427, filed on Apr. 25, 2011, and
entitled "ANTENNA"; U.S. Design patent application Ser. No.
29/390,432, filed on Apr. 25, 2011, and entitled "ANTENNA"; U.S.
Design patent application Ser. No. 29/390,435, filed on Apr. 25,
2011, and entitled "ANTENNA"; U.S. Design patent application Ser.
No. 29/390,436, filed on Apr. 25, 2011, and entitled "ANTENNA";
U.S. Design patent application Ser. No. 29/390,438, filed on Apr.
25, 2011, and entitled "ANTENNA"; and U.S. Design patent
application Ser. No. 29/390,442, filed on Apr. 25, 2011, and
entitled "ANTENNA", the entire disclosure of each of which is
hereby incorporated by reference.
[0120] An exemplary method for fabricating a conductive particle
based conformable antenna using a template is described below with
reference to FIG. 8.
[0121] FIG. 8 illustrates a method for fabricating a conductive
particle based conformable antenna using a template according to
an exemplary embodiment of the present invention. Herein, the
conductive particle based material used to fabricate the
conductive particle based conformable antenna is assumed to be
formulated as a liquid, paint, gel, ink, or paste that dries or
cures.
[0122] Referring to FIG. 8, a template and substrate is chosen in
step 800. In step 810, the chosen template may be fixed against
the chosen substrate. In step 820, the conductive particle based
material may then be applied on the template such that the
conductive particle based material passes through at least one cut
out portion of the template so as to be applied to the
corresponding portion of the substrate. The conductive particle
based material may be applied until its particle density reaches a
certain threshold. This may be determined by measuring the
resistance of the material across the length of the antenna (or
antenna segment). Here, the threshold may correspond to a
predefined resistance or range of resistances (e.g., 11-15 ohms).
[0123] The template may then be removed leaving the conductive
particle based material to dry or cure on the chosen substrate
according to the desired design. In step 830, one or more coupling
points of a feed line may be affixed to the conductive particle
based conformable antenna. Herein, step 830 may be omitted. In
addition, additional steps may be included, such as applying at
least one of an insulative coating, a surface preparation coating,
a protective coating, and a concealment coating. Any or all of
this fabrication technique may be automated, as will be described
below.
[0124] While a conductive particle based conformable antenna is
described herein, any disclosure related to a conductive particle
based conformable antenna is equally applicable to a conductive
particle based conformable antenna enhancer.
Fabrication Techniques for Conductive Particle Based
Conformable Antenna
[0125] In one exemplary embodiment, techniques for constructing a
conductive particle based conformable antenna are described.
Herein, a computerized device is used to generate a template that
is used to construct a conductive particle based conformable
antenna.
[0126] The computerized device may be any of a desktop computer, a
laptop computer, a netbook, a tablet computer, a Personal Data
Assistant (PDA), a Smartphone, a portable media device, a
specialized mobile device, etc. The computerized device may
include one or more of a display, an input unit, a control unit, a
printer, memory, a communications unit, and a projection unit.
[0127] The conductive particle based conformable antenna that is
constructed using the template may be formed using the conductive
particle based material that is sprayable, rollable or brushable.
The conductive particle based material may be applied directly
onto any substrate. The conductive particle based conformable
antenna, once fabricated onto a surface, may be painted over with
a paint in order to conceal the antenna, provide protection to the
antenna, or provide the antenna with desired aesthetics.
[0128] According to an exemplary embodiment of the present
invention, to create and install an antenna, the computerized
device may be used to generate the template. The computerized
device may include a graphical user interface that queries a user
regarding certain characteristics/criteria or otherwise allows a
user to enter certain characteristics/criteria. Based on the input
characteristics/criteria, the computerized device generates the
template. Herein, the user may input less than all of the
characteristics/criteria. In this case, the
characteristics/criteria not input by the user may be obtained via
a formula, or a local or remote database. In addition, assumed
values for the characteristics/criteria not input by the user may
be used.
[0129] Examples of the characteristics/criteria include one or
more of a substrate on which the antenna will be disposed,
frequency of operation, aperture or antenna pattern, whether a
space saving design is desired, velocity factor, resonant
frequency, Q factor, impedance, gain, polarization, efficiency,
bandwidth, heat characteristics, type of amplifier, environment,
etc. Further, one or more of the characteristics/criteria may
include a number of preset options for a given
characteristic/criteria. For example, the options for the
substrate on which the antenna will be disposed may include one or
more of wood, metal, glass, plastic, etc. For another example, the
options for the desired antenna pattern include one or more of an
omni-directional antenna pattern, a directional antenna pattern, a
circular antenna pattern, a phased array antenna pattern, etc.
[0130] The computerized device may guide a user in inputting at
least one of the one or more the characteristics/criteria and may
request additional information from the user.
[0131] Based on the input one or more characteristics/criteria,
the computerized device determines an antenna pattern using a
pattern determination algorithm. The antenna pattern may be a
preset antenna pattern or an antenna pattern formed based on an
algorithm and the input one or more characteristics/criteria. In
addition, the computerized device may determine one or more of a
scaling factor of the antenna pattern, dimensions of the antenna
pattern or elements of the antenna pattern, grain direction,
application notes, etc. Alternatively, or additionally, the
characteristics/criteria may not be preset.
[0132] The computerized device may determine more than one antenna
pattern and may allow a user to select a desired antenna pattern
from among the determined more than one antenna pattern.
[0133] Once the antenna pattern is determined, as well as one or
more of the scaling factor of the antenna pattern, dimensions of
the antenna pattern or elements of the antenna pattern, grain
direction, application notes, etc., a resulting template may be at
least one of displayed on the display of the computerized device,
projected onto a surface using the projection unit of the
computerized device, and printed using one of an external and an
integrated printed. When a projection unit is employed, the
computerized device may further include a device that adjusts the
scale of the projected template based on at least the distance
between the projection unit and the surface on which the antenna
is to be constructed. Further, when a projection unit is employed,
the computerized device may further include a device that adjusts
the location of the projected template so that the projected
template remains on the same location of the surface regardless of
the movement of the computerized device. The template may then be
used to construct the antenna.
[0134] Also, the template may correspond to digital data that is
stored in a storage device or communicated to another device that
applies the antenna material based on the digital data.
[0135] In one exemplary embodiment, the computerized device
communicates the input characteristics/criteria to a remote
computerized device which determines one or more of the antenna
pattern, the scaling factor of the antenna pattern, dimensions of
the antenna pattern or elements of the antenna pattern, grain
direction, application notes, etc., which is then communicated to
the computerized device.
[0136] In one exemplary embodiment, the antenna patterns may be
stored remotely from the computerized device and communicated to
the computerized device before or after the antenna pattern is
determined. The antenna patterns may be communicated to the
computerized device in response to a request by the computerized
device or another entity.
[0137] An exemplary method for fabricating a conductive particle
based conformable antenna using a computerized device is described
below with reference to FIG. 9.
[0138] FIG. 9 illustrates a method for fabricating a conductive
particle based conformable antenna using a computerized device
according to an exemplary embodiment of the present invention.
[0139] Referring to FIG. 9, in step 900, the
characteristics/criteria are obtained by the computerized device
as described above. In step 910, an antenna pattern is selected by
the computerized device based on the obtained
characteristics/criteria, as described above. In step 920, a
template is generated as described above.
[0140] An example of the computerized device described above is
described below with reference to FIG. 10.
[0141] FIG. 10 illustrates a structure of computerized device used
for fabricating a conductive particle based conformable antenna
according to an exemplary embodiment of the present invention.
[0142] Referring to FIG. 10, the computerized device includes a
controller 1010, a display unit 1020, a memory unit 1030, an input
unit 1040, a communications unit 1050, a template generator 1060,
and an antenna generator 1070. One or more of the components of
the computerized device shown in FIG. 10 may be omitted. Also, the
functions of one or more of the components of the computerized
device shown in FIG. 10 may be performed by a combined component.
In addition, additional components may be included with the
computerized device.
[0143] The controller 1010 controls the overall operations of the
computerized device. More specifically, the controller 1010
controls and/or communicates with the display unit 1020, the
memory unit 1030, the input unit 1040, the communications unit
1050, the template generator 1060, and the antenna generator 1070.
The controller 1010 executes code to have performed or perform any
of the functions/operations/algorithms/roles explicitly or
implicitly described herein as being performed by a computerized
device. The term "code" may be used herein to represent one or
more of executable instructions, operand data, configuration
parameters, and other information stored in the memory unit 1030.
[0144] The display unit 1020 is used to display information to a
user. The display unit 1020 may be any type of display unit. The
display unit 1020 may be integrated with or separate from the
computerized device. The display unit 1020 may be integrated with
the input unit 1040 to form a touch screen display. The display
unit 1020 performs any of the functions/operations/roles
explicitly or implicitly described herein as being performed by a
display.
[0145] The memory unit 1030 may store code that is processed by
the controller 1010 to execute any of the
functions/operations/algorithms/roles explicitly or implicitly
described herein as being performed by a computerized device. In
addition, one or more of other executable instructions, operand
data, configuration parameters, and other information may be
stored in the memory unit 1030. Depending on the exact
configuration of the computerized device, the memory unit 1030 may
be volatile memory (such as Random Access Memory (RAM)),
non-volatile memory (e.g., Read Only Memory (ROM), flash memory,
etc.) or some combination thereof.
[0146] The input unit 1040 is used to enable a user to input
information. The input unit 1020 may be any type or combination of
input unit, such as a touch screen, keypad, mouse, voice
recognition, etc.
[0147] The communications unit 1050 transmits and receives data
between one or more entities. The communications unit 1050 may
include any number of transceivers, receivers, and transmitters of
any number of types, such as wired, wireless, etc.
[0148] The template generator 1060 may perform any of the
functions/operations/algorithms/roles explicitly or implicitly
described herein as being performed when generating a template.
For example, the template generator 1060 may be a printer, a
cutter, a projector, a display, etc.
[0149] The antenna generator 1070 may perform any of the
functions/operations/algorithms/roles explicitly or implicitly
described herein as being performed when generating an antenna.
For example, the template generator 1060 may be a sprayer that
sprays the conductive particle based material onto a substrate.
[0150] Herein, the functionality described above of the
computerized device may result from an application installed on
and being executed by the computerized device.
[0151] At this point it should be noted that the present exemplary
embodiment as described above typically involve the processing of
input data and the generation of output data to some extent. This
input data processing and output data generation may be
implemented in hardware, or software in combination with hardware.
For example, specific electronic components may be employed in a
mobile device or similar or related circuitry for implementing the
functions associated with the exemplary embodiments of the present
invention as described above. Alternatively, one or more
processors operating in accordance with stored instructions (i.e.,
code) may implement the functions associated with the exemplary
embodiments of the present invention as described above. If such
is the case, it is within the scope of the present disclosure that
such instructions may be stored on one or more non-transitory
processor readable mediums. Examples of the non-transitory
processor readable mediums include ROM, RAM, Compact Disc
(CD)-ROMs, magnetic tapes, floppy disks, and optical data storage
devices. The non-transitory processor readable mediums can also be
distributed over network coupled computer systems so that the
instructions are stored and executed in a distributed fashion.
Also, functional computer programs, instructions, and instruction
segments for accomplishing the present invention can be easily
construed by programmers skilled in the art to which the present
invention pertains.
[0152] While the invention has been shown and described with
reference to certain exemplary embodiments thereof, it will be
understood by those skilled in the art that various changes in
form and details may be made therein without departing from the
spirit and scope of the invention as defined by the appended
claims and their equivalents.
ChamTech Patents
Antenna
USD652029
Antenna
USD652410
Antenna
USD652028
Antenna
USD652027
Antenna
USD652409
NEAR FIELD COMMUNICATIONS SYSTEM HAVING ENHANCED SECURITY
WO2009021220
SYSTEM AND METHOD FOR NEAR FIELD COMMUNICATIONS HAVING
LOCAL SECURITY
WO2009042977
Nano Copper
NANO-COPPER PATENTS
Surface plasmon resonance rectenna and preparation method
therefor
CN102544182
The invention provides a surface plasmon resonance rectenna
and a preparation method therefor. The surface plasma resonance
rectenna adopts a three-layer structure, wherein the lower layer
is made from metal Ti; a TiO2 nanotube array layer is generated on
one surface of the metal Ti in an oxidation manner; a Cu nano
particle metal layer is arranged on the surface of the TiO2
nanotube array layer through photodeposition; and the
micro-surface appearance of the Cu nano particle metal layer is
nano particles. In the invention, as photodeposition replaces
ultrahigh vacuum electron beam evaporation technology, and
inexpensive metal copper Cu replaces precious metal Au to prepare
the rectenna adopting the Ti/TiO2NT/Cu structure, the difficult
problem that the conventional metal layer can not be used in
large-scale industrial production due to high cost in deposition
technology, equipment investment and precious metal, and green
low-cost development of solar energy technology is facilitated.
Method for preparing copper nanowires and copper nano pointed
cones
CN102776469
The invention discloses a method for preparing copper
nanowires and copper nano pointed cones. The method comprises the
steps of heating a copper substrate in oxygenated atmosphere to
form a copper oxide thin film or a copper oxide nanowire thin
film, placing the films into a vacuum chamber, performing
bombarding by using a argon ion source, and controlling the energy
and the time of the ion bombarding to obtain nanowires or copper
nano pointed cone arrays. According to the method, no catalyst is
used, copper nanowires and copper nano pointed cones, which have
different density and sizes are prepared on the substrate
conveniently, and the prepared copper nanowires and copper nano
pointed arrays can be applied to photoelectric devices such as a
display device, a lithium battery, a super capacitor and the like.
Method for preparing ultrafine copper powder for electronic
paste
CN102764898
The invention belongs to the field of electronic paste and
particularly relates to a method for preparing a ultrafine copper
powder for the electronic paste, comprising the step of adding a
dispersing agent and a reducing agent into a copper salt aqueous
solution to reduce the elemental copper. The method is
characterized in that nano-copper particles are added into the
copper salt aqueous solution before the dispersing agent and the
reducing agent are added, wherein the nano-copper particles have
the size of 5-20nm, and the addition amount of the nano-copper
particles is 0.3-0.6 per mill of the mass of copper salt in the
copper salt aqueous solution. The method is simple in process and
flexible to operate. The raw materials are nontoxic,
environmentally friendly and suitable for industrial production.
The ultrafine copper powder prepared by the adopting the method
has uniform and controllable particle size, a narrow distribution
range and high purity.
Preparation method of nano porous copper capable of being
patterned
CN102766893
The invention discloses a preparation method of nano porous
copper capable of being patterned, comprising the following steps:
(1), sputtering a Cr-Cu seed layer on a sheet glass, spin coating
positive photo-resist, baking the photo-resist, exposing, and
developing in turn, so as to pattern the nano porous copper
photo-resist; (2), depositing a copper stress buffer layer and a
Cu-Zn alloy layer by the electro-deposition technique, to obtain a
patterned precursor alloy thin film; and (3), performing
de-alloying treatment on the patterned Cu-Zn patterned precursor
alloy thin film in an acidic solution, removing the positive
photo-resist, finally implementing the patterned nano porous
copper so as to obtain a nano porous copper array. The preparation
method and the micro-processing technique are compatible;
specifically, the nano porous copper arrays with various patterns
are obtained by the photo resist patterning technique, the Cu-Zn
alloy co-deposition technique, and the de-alloying technique; the
preparation method has the advantages of simple process, low cost,
easy control, and good compatibility to the micro-processing
technique.
Method for preparing nano copper lubricating material by wire
electrical explosion method
CN102744414
The invention relates to a method for preparing a nano copper
lubricating material by a wire electrical explosion method. On the
aspect of preparing the nano lubricating material, the method
effectively solves the agglomeration problem in the process of
preparing nano metal powder by the existing electrical explosion
method and fundamentally eliminates the problems of derivatives
and impurities in the process of preparing the nano lubricating
material by a chemical method. The method comprises the specific
steps of: by a device comprising parts such as a high voltage
discharge system, a wire throwing system, a liquid circulating
system, a vacuum system, an explosion chamber and the like, after
vacuumizing to the pressure of minus 0.1MPa and filling argon to
the pressure of 0.1 to 0.2MPa, implementing effective crushing on
a copper wire section with the specification of phi 0.2*(35 to
60)mm under a voltage of 7 to 13KV and simultaneously infiltrating
the obtained product into lubricating oil; and in the electrical
exploding process, directly generating a modified thin film on the
surface of nano copper powder so as to form nano lubricating oil.
NANOMETER-SIZED COPPER-BASED CATALYST, PRODUCTION METHOD
THEREOF, AND ALCOHOL PRODUCTION METHOD USING THE SAME THROUGH
DIRECT HYDROGENATION OF CARBOXYLIC ACID
EP2561928
Also published as: US2013030224 (A1)
WO2011132957 (A2) WO2011132957 (A9) WO2011132957
(A3) CN102946994 (A)
Disclosed is a nano-sized Cu based catalyst and a method of
preparing the same including dissolving, in an aqueous solution, a
first component comprising a Cu precursor, a second component
precursor comprising one or more selected from the group
consisting of a transition metal, an alkaline earth metal and a
Group IIIb metal, and a third component precursor comprising one
or more selected from the group consisting of alumina, silica,
silica-alumina, magnesia, titania, zirconia and carbon and then
performing stirring; precipitating the stirred mixture solution
using Na2CO3 and NaOH to form a catalyst precursor precipitate;
and washing and filtering the formed catalyst precursor
precipitate. Also a method of preparing alcohol is provided,
including reacting hydrogen with carboxylic acid including a
single acid or an acid mixture of two or more acids derived from a
microorganism fermented solution, using the nano-sized Cu based
catalyst.
Copper nano powder and preparation method of copper nano
powder
CN102601381
The invention discloses copper nano powder and a preparation
method of the copper nano powder. The powder is prepared by the
following methods: preparing copper salt solution from copper
salt, adding a drag reduction agent and an inhibitor into the
copper salt solution to prepare copper salt mixing solution and
pre-heating the copper salt mixing solution; preparing reducing
agent solution, adjusting the pH value of the reducing agent
solution, and pre-heating the reducing agent solution; uniformly
mixing and agitating the copper salt mixing solution and the
reducing agent solution, heating the mixture to the reaction
temperature to enable the mixture to react for a certain time so
as to obtain nano copper suspension solution; aging the nano
copper suspension solution; performing vacuum filtration on the
suspension solution obtained from the above steps to obtain the
copper nano powder in which the impurity is not removed;
processing the copper nano powder to obtain the copper nano powder
cladded by organic solvent; performing vacuum filtration on the
copper nano powder to obtain wet copper nano powder, and
performing low-temperature vacuum drying on the copper nano powder
obtained from the above steps so as to obtain the copper nano
powder product. The powder is small in particle size and narrow in
particle size distribution. The method is controllable in reaction
process, simple in technology and suitable for industrial
production.
Water-soluble nano-copper and preparation method thereof
CN102554217
The invention belongs to the technical field of nanometer
materials, and particularly relates to water-soluble nano-copper
and a preparation method of the water-soluble nano-copper, wherein
the water-soluble nano-copper is nano-copper clusters which are
surface-modified by stable organic single molecules formed in a
way that organic compound surface modifier containing sulfydryl is
bonded on the surface of copper nanoparticles. The invention can
obtain copper nanoparticles which can be effectively dispersed in
water phases and can exist stably, and is simple in preparation
process and preparation devices, low in raw material cost, low in
the production cost, high in yield, and suitable for large-scale
industrial production, and the raw materials are easily
accessible.
New method of preparing powder nano material
CN1436626
The new nano powder material preparing process of the present
invention is suitable for preparing carbide, nitride and particle
metal powder. The preparing process includes pumping the reactor
into vacuum, filling protecting gas or reaction gas, setting
graphite electrode inside the reactor, applying voltage between
the graphite electrode and the metal inside the crucible inside
the reactor to produce high temperature carbon arc and metal
vapor. When protecting gas is filled, nano nickel powder, copper
powder, aluminum powder and other metal powder coated by graphite
atoms with less agglomeration may be prepared. When reaction gas
is filled, nano carbide or nitride powder may be prepared.
Compared with available technology, the produced nano powder has
less agglomeration, the production process has low cost and great
arc power and is suitable for large scale production and is widely
applicable.
METHOD FOR PREPARING NANO-PARTICLES
EP1550633
Also published as: EP1550633 (A4)
EP1550633 (B1) US2004197884 (A1) US7204999
(B2) JP3703479 (B2) more
The method of the production of a nanoparticle of the present
invention includes a step of forming a nanoparticle including a
compound of a metal ion in a cavity part of a protein, in a
solution containing the protein having the cavity part therein,
the metal ion, and a carbonate ion and/or a hydrogen carbonate
ion. Examples of the aforementioned compound include e.g., a
hydroxide. The aforementioned metal ion is preferably any one of a
nickel ion (Ni<2+>), a chromium ion (Cr<2+>) or a
copper ion (Cu<2+>). According to the aforementioned method,
nanoparticles having a uniform particle diameter can be produced.
Method for manufacturing nano-copper
CN1557589
The present invention is nano copper preparing process and
belongs to the field of nano material preparing technology in
radiochemistry. The technological process includes adopting copper
sulfate as copper source, isopropanol as oxidant clearer in water
solution, hydrophilic suitable for PVA for controlling the crystal
kernel growth speed and grain size and electronic accelerator to
produce electron beam for irradiation treatment; washing
irradiated solution, centrifugal separation and stoving to obtain
claret nano copper powder. The present invention has simple
technological process, short production period, no pollution and
high safety.
Method for preparing nano copper particle
CN1709617
Also published as: US2006053972 //
US7422620
The invention discloses a method for preparation of nm copper
grains with very perfect dispersitivity. It comprises copper
hydrosol prepared by reduction method, using organic liquor which
contains specifical extraction solution to extract copper
colloidal granules, and altering polarity of the organic phase to
separate nm copper granules. The preparation has very many
characteristics, for example, cheap and handy raw material,
simplicity and convenience, low cost, high productivity and so on.
It fits large-scale industrial production and the diameter of
manufactured nm copper granules is between one and ten nm. Also it
stabilizes in the air and is able to scatter in the industrial
non-polarity organic liquor and kinds of lube. In conclusion, it
has extensive industrial purposes.
POWDERS OF NANO CRYSTALLINE COPPER METAL AND NANO CRYSTALLINE
COPPER ALLOY...
WO2005092541
A nano crystalline copper metal powder, which comprises
aggregates of nano crystal grains of copper metal or a copper
alloy, wherein the nano crystal grain has a size of 2 to 1000 nm;
a bulk material of a nano crystal copper or copper alloy
exhibiting high hardness, high strength, high electric
conductivity and high toughness, which comprises a great number of
above nano crystal grains being firmly bound with one another; and
a method for producing the above bulk material of a nano crystal
copper or copper alloy exhibiting high hardness, high strength,
high electric conductivity and high toughness, which comprises
subjecting the above copper powder or copper alloy powder to a
solidification forming such as a vacuum hot solidification forming
or an explosive forming, for example, a spark plasma sintering at
a temperature of 250 to 700 DEG C, hot pressing, sheath rolling,
hot forging, extruding or hot isotropic pressure forming (HIP).
A method and apparatus for the production of copper nanofluids
by using chemical method
TWI262111
A method for the production of copper nanofluids uses chemical
reduction method. For synthesis of nanofluids containing Cu
nanoparticles, copper precursor and reactants (e.g. reducing
agent) are mixed uniformly. By controlling the reaction rate and
environment, copper particle in nano scale is obtained through
nucleation and growth process. The copper nanoparticle can
increase the thermal conductivity of nanofluids with its higher
thermal conductivity compared with that of fluids.
Preparation of nano copper fluid
CN101264525
The invention relates to a preparation process, belonging to
the technical field of the preparation processes for inorganic
materials, which comprises the following steps: metallic copper
salt and polyethylene pyrrolidone are dissolved into ethylene
glycol to form settled solution, then reducing agent is added into
the solution and mixed evenly; the mixed liquor is put into a
microwave stove for heating and reaction, after cooling, Cu/
ethylene glycol nanometer fluid is obtained. Therefore, the
preparation process has the advantages of simple process, low
cost, high yield, and facility for industrial production;
moreover, the product acquired by use of the preparation process
has the advantages of good dispersibility, long-term stability
with a plurality of better performances than prior products, and
wide popularization and application prospects.
Production of nano-catalyst
CN101028600
A process for preparing the nano-catalyst used to selectively
adsorb and convert harmful substances includes such steps as
adding copper sulfate and manganese sulfate to deionized water,
heating to 80-90 deg.C, stirring, adding strong alkali solution,
stirring, filtering, washing the filtered cake until it becomes
neutral, drying, calcining, cooling and sieving.
ELECTRODE, AND APPARATUS AND METHOD FOR MANUFACTURING METALLIC
FINE PARTICLE
JP2007270184
PROBLEM TO BE SOLVED: To provide a method for manufacturing
copper nano particles by which granular nano sized metal fine
particles are efficiently manufactured without growing a reduced
metal like dendrite (tree branch) and without enlarging the
particle size in the mass production of the particles. ; SOLUTION:
In the method of manufacturing the copper nano particles, the
copper nano particles are manufactured by applying current between
an anode comprising copper and a cathode comprising aggregate of
many acicular projections of platinum and electrically insulated
from the anode. The platinum acicular projections are, for
example, cylindrical platinum having <=1 [mu]m diameter or
rectangular platinum having <=1 [mu]m one side length and
electrolytically deposited on a conductive electrode.
Method for preparing nano copper powder and copper slurry
CN101077529
The present invention is process of preparing nanometer copper
powder and copper slurry with high antioxidant performance. The
process includes solvent replacement, the first reduction, the
second reduction, separation, drying and other steps. The present
invention has the features of simple preparation process at normal
temperature and normal pressure, low production cost, the
effective protection of produced nanometer copper particle in
organic phase, small copper powder size, environment friendly
preparation process, etc. The prepared nanometer copper powder and
copper slurry may be applied in producing large scale PCB,
conducting ink, multilayer ceramic capacitor, etc.
Method for preparing nano copper powder
CN101372037
The invention discloses a method for preparing copper
nanoparticle. The preparation method is as follows: cupric salt is
taken as raw materials; hydroborate serves as reducer; reducer
aqueous solution is poured into cupric salt aqueous solution which
complexes with ammonia and is stirred quickly, when the cupric
salt aqueous solution becomes colorless, the copper nanoparticle
is prepared. When the stirring is stopped, the copper nanoparticle
sinks quickly, the supernatant fluid is dumped. The copper
nanoparticle is washed with water repeatedly, stands and is
clarified, and the supernatant fluid is dumped. Finally being
filtered, the copper nanoparticle with good dispersibility is
prepared by being dried in the flow argon atmosphere. The
preparation method has simple production technology, is easy to
operate. The copper nanoparticle can be produced on a large scale;
and an appropriate covering layer can be covered on the surface of
the copper nanoparticle.
COPPER MICROPARTICLE, METHOD FOR PRODUCTION OF COPPER
MICROPARTICLE
WO2008041780
Disclosed is a method for producing a copper microparticle,
which comprises: a first reduction step for mixing an unsaturated
fatty acid solution containing a copper ion with an aldose (a
reducing monosaccharide) solution to form an emulsion; a second
reduction step for adding an aqueous ascorbic acid solution to the
emulsion; and a copper microparticle separation step. The method
can produce a copper microparticle which has an average particle
diameter of 100 nm or smaller and whose surface is partly or
entirely modified with a carboxyl terminal group derived from the
unsaturated fatty acid. The copper microparticle produced by the
methodshows high dispersibility in spite of having a nano-order
size.
METHOD FOR MANUFACTURING METAL NANO PARTICLE SOLUTION
US2009176875
A method for manufacturing a stabilized metal nano particle
solution is disclosed. This method manufactures a metal nano
particle solution so as to make a metal substance such as silver,
gold, copper, zinc or cobalt into ultra-capsular nano particles.
That is to say, this new method is simple and suitable for mass
production without requiring any separate reducer putting process
at a room temperature while a transition metal nano particle
solution is produced. In this method, an alcohol solution
including a metal salt solution and a soluble polymer is mixed at
a room temperature to make a nano metal particle solution with a
particle size of 100 nm or less.
Method for preparing metallic simple substance nano-crystal
material
CN101279374
A method for preparing metal single substance nanocrystalline
materials is applicable to the preparation of the metal
nanocrystalline materials of copper, silver, lead, palladium, tin,
antimony and so on. A melted composite alkali metal hydroxide
solvent is used for carrying out the chemical reaction synthesis
under the atmospheric pressure and the temperature of 100 to 300
DEG C, the used raw materials are soluble inorganic metal salts
and zinc powder or iron powder, the cost during the synthesis
process is low, various parameters in the reaction process are
easy to be monitored and controlled, the environmental pollution
is less, the evenness of a reaction system is good, the process is
simple and the production is easy to be enlarged; ; furthermore,
the obtained metal crystal has good crystallization, clean surface
and even size, which is applicable to the research of intrinsic
properties and the maximization of the functions of the
nanocrystalline materials. The metal single substance
nanocrystalline materials of the metal nanocrystalline materials
are characterized by metal properties, electric and electronic
properties, magnetic properties, chemical properties, thermal
properties and luminous properties etc., which can be widely used
in superconductive, chemical, medical, optical, electronic,
electric appliance and other industries.
Surface finish nano copper/copper alloy particles and
preparation thereof
CN101259531
The invention relates to a nano-copper/copper alloy particle
for surface modification, which is prepared by the following
method that: water solution of copper salt or copper salt and
alloy component salt with the concentration of 0.001 to 1 mol/L is
prepared, then the water solution is fully mixed with the mixed
solution of a reductant, a surface modifier and a weak polar or
non-polar organic solvent, the still placement is carried out for
30 to 180min after the reaction for 30 to 180min under the
alkaline environment with pH of 8 to 13, the organic phase is
obtained by separation, and the nano-copper/copper alloy particle
for surface modification is obtained after the concentration.; The
copper/copper alloy nanoparticle for surface modification which is
provided by the invention has controllable particle size and
distribution, difficult clustering, good antioxidant property,
monodisperse property and good dispersion stability in the organic
solvent. The preparation process and a device of the
nano-copper/copper alloy particle for surface modification are
simple, the raw materials are cheap and easy to obtain, the cost
is low, and the yield is high, thus being applicable to the
large-scale industrial production.
Method for preparing metallic copper nano particle
CN101337277
The invention relates to a method for preparing metallic
copper nanoparticles, and belongs to the technical field of
preparing nanomaterial by liquid-phase chemical reduction. The
method adopts sodium hydrosulfite as a reducer to reduce cupric
hydroxide under alkaline conditions, and adopts sodium dodecyl
sulfate as a dispersant to generate copper nanoparticles with the
grain diameter of 30 to 90nm. The method has the characteristics
of simple technological process, low production cost and
suitability for industrialized production.
Preparation method of whole continuous nano-porous copper
CN101596598
The invention relates to a preparation method of whole
continuous nano-porous copper, comprising the following steps: (1)
heating the pure metallic aluminum and copper to the molten state,
stirring and mixing the mixture to form Cu-Al alloy liquid; (2)
fast blowing the alloy liquid out with inert gas to solidify the
molten liquid metal on the copper rollers which rotate in high
speed and prepare alloy strips, or solidify the molten liquid
metal in copper molds to prepare alloy plates or alloy bars; and
(3) performing dealloying process to the obtained alloy, cleaning
the alloy in the distilled water to be neutral and airing the
alloy to obtain nano-porous copper. The beneficial effects of the
invention are as follows: (1) the produced nano-porous copper is
whole continuous and whole continuous nanosize bulk materials can
also be prepared; (2) low concentration of corrosion solution is
used to prepare nano-porous copper in the method of the invention,
and the operation process is simple and the method is suitable for
large-scale industrialized production; and (3) according to the
components of the mother alloy and the types of corrosion
solution, the structure and size of nanoporous copper can be
regulated.
Preparation method of nano-copper
CN101607317
The invention belongs to the nanometer material technical
field, in particular to a preparation method of nano-copper,
comprising the following steps: dissolving copper salt and organic
protective agents in a solvent, heating the solution to 30-100 DEG
C, simultaneously adding reducing agent in the reaction system to
react while stirring for 20-30min, then cooling gradually;
standing the cooled solution, and then centrifuging and finally
washing the solution with ethanol and acetone repeatedly to obtain
pure nano-copper. The invention has simple process, mild reaction
conditions and short reaction time; in the reaction process, two
protective agents are both adopted to prevent the growth and
oxidation of nano-copper; the product performance is good, the
particle size of nano-copper is less than 20nm, the nano-copper
can not be oxidized for one month in the air; the production cost
is low and no hazardous waste can be generated, thus meeting the
demand of 'green production'.
PROCEDURE FOR PRODUCTION OF NANO DISPERSED COPPER POWDER
RU2009147519
FIELD: metallurgy. ^ SUBSTANCE: procedure for production of
nano dispersed copper powder by reduction consists in mixing
copper salt with solution of glucose, in dissolving salt at
heating, in introduction of sodium hydroxide, in conditioning
under isothermal mode and in successive extraction of metal copper
in form of nano dispersed powder. Also, sulphate of copper is used
as copper salt. Copper sulphate is mixed with solution of glucose
at mole ratio of glucose to copper equal to (1.0-2.5):1.0.
Dissolving is carried out at 50-60C. Sodium hydroxide is
introduced upon complete copper sulphate dissolving and solution
heating to temperature 70C.; It is carried out gradually at
several stages for maintaining pH equal to 6-11 in process of
reduction reaction, preferably, to 8-9, first to formation of
oxide of univalent copper, and further to metal copper. ^ EFFECT:
simplified, with reduced prime cost process of production of nano
dimension particles of copper due to reduced number of process
operations of synthesis.
Method for preparing copper zinc tin sulfur selenium nano
particles
CN101830444
The invention relates to a method for preparing copper zinc
tin sulfur selenium nano particles, which belongs to the technical
field of photoelectric materials. The method comprises the
following steps of: 1, mixing divalent zinc salt, divalent tin
salt and monovalent or divalent copper salt, adding surfactant
into the mixture, and heating the mixture; 2, mixing sulfur powder
with selenium powder, adding the surfactant into the mixture, and
heating the mixture; and 3, injecting solution obtained by the
step 2 into solution obtained by the step 1 for warming, and
purifying a product to prepare the copper zinc tin sulfur selenium
nano particles. The preparation method has the advantages of no
pollution, mild and simple reaction condition and low cost, and is
suitable for large-scale production. The forbidden band width of
the copper zinc tin sulfur selenium nano particles can change with
the proportion change of sulfur selenium.
Method for preparing flaky nano copper powder
CN101890504
The invention discloses a method for preparing flaky nano
copper powder, comprising the following steps: compounding a
copper salt aqueous solution with a surfactant to obtain a mixed
solution A, wherein the water in the copper salt aqueous solution
and the surfactant form a surfactant compound system; (2)
compounding a reducing agent aqueous solution with the surfactant
which is the same as that used in step (1) to obtain a mixed
solution B, wherein the water in the reducing agent aqueous
solution and the surfactant form the surfactant compound system;
(3) mixing the mixed solution B obtained in step (2) and the mixed
solution A obtained in step (1) by stirring at the temperature of
20 DEG C to 80 DEG C, and reacting completely with stirring; and
(4) carrying out solid and liquid separation on the product,
washing the solid, and carrying out vacuum drying to obtain the
flaky nano copper powder. The method of the invention has mild
condition, simple process, short production period, low equipment
investment and low preparation cost, and is easy to realize
industrial production. The prepared flaky nano copper powder has
consistent appearance, uniform size and good dispersibility.
Method for preparing nano-copper
CN101890506
The invention relates to a method for preparing nano-copper.
The method comprises the following steps of: dispersing a copper
precursor into the liquid paraffin serving as a solvent and a
reducing agent; adding a surfactant into the liquid paraffin with
stirring; performing heat treatment for 2 to 4 hours in an
atmosphere of N2 protective gas or no protective gas; standing;
centrifuging to obtain a product; and alternately washing the
product by using petroleum ether, distilled water or absolute
ethyl alcohol to obtain the nano-copper. The nano-copper powder
prepared by using the method has the advantages of particle sizes
of less than 50 nm, uniform distribution, difficult oxidation,
high dispersibility in polar solvents or non-polar solvents, cheap
raw materials, low energy consumption, simple process equipment
and easy large-scale production.
Preparation method of nano-copper powder
CN102586800
The invention discloses a preparation method of nano-copper
powder, which comprises the following steps of: in a self-made
special electrolytic cell, taking metal copper as an anode, taking
conducting material as a cathode, taking electrolyte as organic
alcohol, taking ammonium salt which is soluble in the electrolyte
as electrolyte, forbidding the ammonium salt to participate
chemical reaction, and combining the cathode copper with the
organic alcohol, so that the precursor of the nano-copper can be
generated; mixing the precursor of the nano-copper, the organic
alcohol or the other saturated hydrocarbon with the unsaturated
hydrocarbon liquid, and sealing the precursor of the mixed
nano-copper in a high-pressure kettle to be subjected to reductive
treatment, so that the nano-copper powder can be obtained; and
separating the nano-copper powder from the mixture of the reduced
nano-copper powder and the organic solvent by an industrial
centrifugal machine device, and washing with industrial alcohol,
so that wet nano-copper powder can be obtained, putting the
nano-copper powder into a vacuum drying oven, and treating, so
that the nano-copper powder which accords with the national
standard can be obtained. The preparation method has the
advantages of being free of pollution in reaction process, small
in investment, low in cost, good in product dispersibility, even
in distribution, and capable of realizing different-quantity
production.
Water-soluble nano-copper and preparation method thereof
CN102554217
The invention belongs to the technical field of nanometer
materials, and particularly relates to water-soluble nano-copper
and a preparation method of the water-soluble nano-copper, wherein
the water-soluble nano-copper is nano-copper clusters which are
surface-modified by stable organic single molecules formed in a
way that organic compound surface modifier containing sulfydryl is
bonded on the surface of copper nanoparticles. The invention can
obtain copper nanoparticles which can be effectively dispersed in
water phases and can exist stably, and is simple in preparation
process and preparation devices, low in raw material cost, low in
the production cost, high in yield, and suitable for large-scale
industrial production, and the raw materials are easily
accessible.
Copper nano powder and preparation method of copper nano
powder
CN102601381
The invention discloses copper nano powder and a preparation
method of the copper nano powder. The powder is prepared by the
following methods: preparing copper salt solution from copper
salt, adding a drag reduction agent and an inhibitor into the
copper salt solution to prepare copper salt mixing solution and
pre-heating the copper salt mixing solution; preparing reducing
agent solution, adjusting the pH value of the reducing agent
solution, and pre-heating the reducing agent solution; uniformly
mixing and agitating the copper salt mixing solution and the
reducing agent solution, heating the mixture to the reaction
temperature to enable the mixture to react for a certain time so
as to obtain nano copper suspension solution; aging the nano
copper suspension solution; performing vacuum filtration on the
suspension solution obtained from the above steps to obtain the
copper nano powder in which the impurity is not removed;
processing the copper nano powder to obtain the copper nano powder
cladded by organic solvent; performing vacuum filtration on the
copper nano powder to obtain wet copper nano powder, and
performing low-temperature vacuum drying on the copper nano powder
obtained from the above steps so as to obtain the copper nano
powder product. The powder is small in particle size and narrow in
particle size distribution. The method is controllable in reaction
process, simple in technology and suitable for industrial
production.
Method for preparing single copper with porous micro/nano
hierarchical structure
CN102672198
The invention discloses a method for preparing single copper
with a porous micro/nano hierarchical structure. The method
comprises the following steps of adding phenol and vitamin C into
a mixed culture of copper ion and ammonia water under the
condition of one atmosphere at the temperature of 10 to 30 DEG C;
quickly reacting; and preparing the single copper with the porous
micro/nano hierarchical structure. By adoption of the preparation
method, special equipment and reaction conditions are not
required, and heating and calcination are not required, or a
porous matrix serving as a template is not required to be added.
The method has the characteristics that the process is simple, the
energy consumption is low, the yield is high and the like, and is
environment-friendly and suitable for large-scale industrial
production.
Method for preparing ultrafine copper powder for electronic
paste
CN102764898
The invention belongs to the field of electronic paste and
particularly relates to a method for preparing a ultrafine copper
powder for the electronic paste, comprising the step of adding a
dispersing agent and a reducing agent into a copper salt aqueous
solution to reduce the elemental copper. The method is
characterized in that nano-copper particles are added into the
copper salt aqueous solution before the dispersing agent and the
reducing agent are added, wherein the nano-copper particles have
the size of 5-20nm, and the addition amount of the nano-copper
particles is 0.3-0.6 per mill of the mass of copper salt in the
copper salt aqueous solution. The method is simple in process and
flexible to operate. The raw materials are nontoxic,
environmentally friendly and suitable for industrial production.
The ultrafine copper powder prepared by the adopting the method
has uniform and controllable particle size, a narrow distribution
range and high purity.
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